MARTIN’s Mini-Oven Reball/Solder Bumping Unit to be Showcased at SMTA Upper Midwest Expo
08:51 EDT 1 Jun 2012 | R&D Magazine
By Nick Gilbert MARTIN has announced that its solder bumping or mini-oven reball unit will be exhibited at the SMTA Upper Midwest Expo & Tech Forum, which will be held on 7 June, 2012. This forum...
Original Article: MARTIN’s Mini-Oven Reball/Solder Bumping Unit to be Showcased at SMTA Upper Midwest Expo
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