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Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
The global Underfill market will reach Volume Million USD in 2017 with CAGR xx% 20182025. The main contents of the report including:
Global market size and forecast
Regional market size, production data and export import
Key manufacturers manufacturing sites, capacity and production, product specifications etc.
Average market price by SUK
Key manufacturers are included based on manufacturing sites, capacity and production, product specifications etc.:
Major applications as follows:
Defense Aerospace Electronics
Consumer Electronics laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.
Regional market size, production data and export import:
Middle East AfricaNEXT ARTICLE