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Global Underfill Market Data Survey Report 2025 [Report Updated: 03112017] Prices from USD $1500

04:40 EST 14 Nov 2017 | BioPortfolio Reports

Summary

Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.

The global Underfill market will reach Volume Million USD in 2017 with CAGR xx% 20182025. The main contents of the report including:

Global market size and forecast

Regional market size, production data and export import

Key manufacturers manufacturing sites, capacity and production, product specifications etc.

Average market price by SUK

Major applications

Key manufacturers are included based on manufacturing sites, capacity and production, product specifications etc.:

Henkel

WON CHEMICAL

NAMICS

SUNSTAR

Hitachi Chemical

Fuji

ShinEtsu Chemical

Bondline

AIM Solder

Zymet

PanacolElosol

Master Bond

DOVER

Darbond

HIGHTITE

Major applications as follows:

Industrial Electronics

Defense Aerospace Electronics

Consumer Electronics laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.

Automotive Electronics

Medical Electronics

Others

Regional market size, production data and export import:

AsiaPacific

North America

Europe

South America

Middle East Africa

Original Article: Global Underfill Market Data Survey Report 2025 [Report Updated: 03112017] Prices from USD $1500

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