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High Density Interconnects HDI board is defined as a board PCB with a higher wiring density per Unit area than conventional printed circuit boards PCB. They have finer lines and spaces <100 m, smaller vias <150 m and capture pads <400 m, I/O>300, and higher connection pad density >20 pads/cm2 than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
This report includes market status and forecast of global and major regions, with introduction of vendors, regions, product types and end industries; and this report counts product types and end industries in global and major regions.
The report includes as follows:
The report provides current data, historical overview and future forecast.
The report includes an indepth analysis of the Global market for HDI , covering Global total and major region markets.
The data of 20172025 are included. Allinclusive market are given through data on sales, consumption, and prices Global total and by major regions.
The report provides introduction of leading Global manufacturers.
HDI market prospects to 2025 are included in sales, consumption and price.
Market Segment as follows:
By Region / Countries
North America U.S., Canada, Mexico
Europe Germany, U.K., France, Italy, Russia, Spain etc
AsiaPacific China, India, Japan, Southeast Asia etc
South America Brazil, Argentina etc
Middle East Africa Saudi Arabia, South Africa etc
HDI PCB 1+N+1
HDI PCB 2+N+2
ELIC Every Layer Interconnection
By EndUser / Application
Young Poong KCC
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